Wire bonding systems and related methods
A wire bond system. Implementations may include: a bond wire including copper (Cu), a bond pad including aluminum (Al) and a sacrificial anode electrically coupled with the bond pad, where the sacrificial anode includes one or more elements having a standard electrode potential below a standard electrode potential of Al.
1. A method for forming a wire bond comprising:
bonding a wire comprising Cu with a bond pad comprising an aluminum alloy; and
electrically coupling a sacrificial anode with the bond pad;
wherein the sacrificial anode does not physically contact the bond pad.
2. The method of claim 1 , wherein the sacrificial anode comprises one of Mg, Hf, Be, or any combination thereof.
3. A method of forming a wire bond comprising:
physically and electrically coupling a sacrificial anode over at least a portion of a bond pad, wherein the bond pad comprises an aluminum alloy; and
forming one of an alloy stack or an intermetallic layer by bonding a wire comprising Cu through the sacrificial anode and to the bond pad.
4. The method of claim 3 , wherein the sacrificial anode comprises one of Mg, Hf, Be, and any combination thereof.
5. The method of claim 3 , wherein the sacrificial anode comprises W.
6. The method of claim 3 , wherein the sacrificial anode comprises Zn.
7. The method of claim 3 , wherein the sacrificial anode comprises Cr.
8. The method of claim 3 , wherein the sacrificial anode comprises Sn.
9. The method of claim 3 , wherein the sacrificial anode comprises one of Mo, Cd, Ni, Co, Fe, Cu, or any combination thereof.
10. The method of claim 3 , wherein the sacrificial anode is entirely over the bond pad.
11. A wire bond system comprising:
a bond wire comprising Cu; and
a bond pad coupled to the bond wire, the bond pad comprising a sacrificial anode;
wherein the sacrificial anode is directly coupled to the bond wire.
12. The system of claim 11 , wherein the sacrificial anode comprises W.
13. The system of claim 11 , wherein the sacrificial anode comprises Zn.
14. The system of claim 11 , wherein the sacrificial anode comprises Cr.
15. The system of claim 11 , wherein the sacrificial anode comprises Sn.
16. The system of claim 11 , wherein the sacrificial anode comprises Fe.
17. The system of claim 11 , wherein the sacrificial anode comprises one of Mo, Cd, Co, Ni, Cu, or any combination thereof.
18. The system of claim 11 , wherein the bond wire comprises a coating comprising one of Au, Ag, Pd, Ni, or any combination thereof.
19. The system of claim 11 , wherein the bond wire further comprises Ni.