Patent Assignment
Reel/Frame 046876/0481
Assignment of Assignor's Interest
Recorded: 2018-09-14
Pages: 8
Assignors
QIN, WENTAO
Executed: 2016-04-05
ANDERSON, HAROLD
Executed: 2016-03-30
ANDERSON, THOMAS
Executed: 2016-03-30
CHANG, GEORGE
Executed: 2016-03-30
GRIVNA, GORDON M.
Executed: 2016-03-30
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Wire Bonding Systems and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 1, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047399/0631 →
Release of Security Interest in Patents Recorded at Reel 047399, Frame 0631
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064078/0001 →