Current sensor packages with through hole in semiconductor

1. A semiconductor die comprising:

a semiconductor substrate of the semiconductor die;

a through hole in the semiconductor substrate extending from one side of the die to an opposite side of the semiconductor die, the through hole configured to receive a current-carrying conductor there through; and

at least one current sensor coupled to the semiconductor substrate and configured to sense current flow in the current-carrying conductor received in the through hole,

the semiconductor die including contact pads configured to receive solder bumps configured to carry signals from the semiconductor die to outside of the semiconductor die.

2. The semiconductor die of claim 1 , wherein the at least one current sensor includes an inductive sensor.

3. The semiconductor die of claim 1 , wherein the at least one current sensor includes a Hall effect sensor.

4. The semiconductor die of claim 3 , wherein the semiconductor die further includes a magnetic field concentrator coil disposed on a surface of the semiconductor die.

5. The semiconductor die of claim 3 , wherein the semiconductor die further includes a magnetic field concentrator coil at least partially inserted in the semiconductor die.

6. The semiconductor die of claim 1 , wherein the at least one current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.

7. The semiconductor die of claim 6 , wherein the one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor are configured to concurrently sense both AC and DC current flows through the current-carrying conductor received in the through hole.

8. The semiconductor die of claim 1 , wherein the semiconductor die has a circular, an oval, a triangular, a quadrilateral, a pentagonal, or a hexagonal shape.

9. The semiconductor die of claim 1 , wherein the current-carrying conductor received in the through hole is galvanically isolated from the semiconductor die.

10. A sensor package comprising:

a semiconductor die including at least one current sensor, the semiconductor die including a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die, the semiconductor die including contact pads configured to receive solder bumps configured to carry signals from the semiconductor die to outside of the sensor package; and

a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package, the second pass through hole being aligned with the first pass through hole and configured to receive a current-carrying conductor,

wherein the at least one current sensor is configured to sense current flow in the current-carrying conductor received in the second pass through hole.

11. The sensor package of claim 10 , wherein the current-carrying conductor received in the second through hole is galvanically isolated from the sensor package.

12. The sensor package of claim 10 , further comprising a lead frame attached to the semiconductor die, the lead frame including a third pass through hole aligned with the first pass through hole extending from the one side of the semiconductor die to the opposite side of the semiconductor die.

13. The sensor package of claim 12 , wherein the lead frame extends from inside of the sensor package to a free end outside the sensor package and is configured to carry signals from the semiconductor die to the outside the sensor package.

14. The sensor package of claim 10 , wherein a conducting material is disposed in the second through hole and bounded by an upper contact pad and a lower contact pad, the upper contact pad configured to be attached to an end of a current-carrying wire, the lower contact pad configured to receive a solder bump connection to complete a current path through the current-carrying wire across the sensor package.

15. The sensor package of claim 10 , wherein the semiconductor die has a hexagonal shape.

16. The sensor package of claim 10 , wherein the at least one current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.

17. The sensor package of claim 16 , wherein the at least one current sensor including one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor is configured to concurrently sense both AC and DC current flows through the current-carrying conductor received in the second pass through hole.

18. A method comprising:

disposing a current sensor in a semiconductor die, the sensor die having a pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die;

disposing the semiconductor die about a conductor wire by passing the conductor wire through the hole in the semiconductor die from the one side of the semiconductor die to the opposite side of the semiconductor die; and

detecting, by the current sensor, a signal proportional to current flow in the conductor wire passing through the hole in the semiconductor die,

the detecting including at least one of detecting a Hall effect voltage in a sensor element or detecting an induced voltage in an inductive coil.

19. The method of claim 18 , wherein the semiconductor die is packaged in a sensor package having a pass through hole extending from one side of the sensor package to an opposite side of the sensor package, and wherein placing the semiconductor die about the conductor wire includes placing the sensor package about the conductor wire with the conductor wire passing through the hole in the sensor package from the one side of the sensor package to the opposite side of the sensor package.

20. The method of claim 19 , wherein placing the semiconductor die about the conductor wire includes galvanically isolating the sensor package from the conductor wire passing through the hole in the sensor package from the one side of the sensor package to the opposite side of the sensor package.

21. A current sensor package comprising:

a current sensor configured to sense current flow in a current carrying conductor that is disposed at least partially through a hole in the current sensor package; and

electrical insulation disposed between and the current carrying conductor and the current sensor, the electrical insulation blocking current flow from the current carrying conductor to the current sensor,

the current sensor sensing the current flow being configured to detect at least one of a Hall effect voltage in a sensor element or an induced voltage in an inductive coil.

22. The current sensor package of claim 21 , wherein the current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.

23. A semiconductor die comprising:

a semiconductor substrate of the semiconductor die;

a through hole in the semiconductor substrate extending from one side of the die to an opposite side of the semiconductor die, the through hole configured to receive a current-carrying conductor there through; and

at least one current sensor coupled to the semiconductor substrate and configured to sense current flow in the current-carrying conductor received in the through hole, the current sensor sensing the current flow being configured to detect at least one of a Hall effect voltage in a sensor element or an induced voltage in an inductive coil.

24. The semiconductor die of claim 23 , wherein the at least one current sensor is configured to concurrently sense both AC and DC current flows through the current-carrying conductor received in the through hole.