Semiconductor device assemblies including spacer with embedded semiconductor die
In a general aspect, a semiconductor device assembly can include a semiconductor die having a first surface including active circuitry, a second surface opposite the first surface, and a plurality of side surfaces. Each of the plurality of side surfaces can extend between the first surface of the semiconductor die and the second surface of the semiconductor die. The semiconductor device assembly can also include a conductive spacer having a cavity defined therein. The semiconductor die can be electrically and thermally coupled with the conductive spacer, the semiconductor die being at least partially embedded in the cavity.
1. A semiconductor device assembly comprising:
a semiconductor die having:
a first surface including active circuitry;
a second surface opposite the first surface; and
a plurality of side surfaces each extending between the first surface of the semiconductor die and the second surface of the semiconductor die;
a conductive spacer having a cavity defined therein, the semiconductor die being electrically and thermally coupled with the conductive spacer, the semiconductor die being at least partially embedded in the cavity; and
a direct bonded metal (DBM) substrate, the DBM substrate being electrically coupled with the first surface of the semiconductor die.
2. The semiconductor device assembly of claim 1 , wherein the semiconductor die is thermally and electrically coupled with the conductive spacer by an adhesive material disposed in the cavity.
3. The semiconductor device assembly of claim 2 , wherein the adhesive material includes at least one of a solder paste or a preform solder.
4. The semiconductor device assembly of claim 1 , wherein the semiconductor die is thermally and electrically coupled with the conductive spacer by a fluxless solder material disposed in the cavity.
5. The semiconductor device assembly of claim 1 , wherein the second surface of the semiconductor die is fully embedded in the cavity of the conductive spacer, and the plurality of side surfaces of the semiconductor die are at least partially embedded in the cavity of the conductive spacer.
6. The semiconductor device assembly of claim 1 , further comprising a low-modulus encapsulation material, the low-modulus encapsulation material being disposed between the conductive spacer and the DBM substrate, and disposed between the first surface of the semiconductor die and the DBM substrate.
7. The semiconductor device assembly of claim 6 , wherein the low-modulus encapsulation material is a silicone gel material.
8. The semiconductor device assembly of claim 6 , further comprising a molding compound, the molding compound encapsulating the semiconductor die, the conductive spacer, the low-modulus encapsulation material and the DBM substrate,
a surface of the DBM substrate being exposed through the molding compound.
9. The semiconductor device assembly of claim 1 , wherein the DBM substrate is a first DBM substrate and the cavity is disposed in a first surface of the conductive spacer, the semiconductor device assembly further comprising:
a second DBM substrate coupled with a second surface of the conductive spacer, the second surface of the conductive spacer being opposite the first surface of the conductive spacer.
10. The semiconductor device assembly of claim 1 , wherein a surface of the conductive spacer includes a circumferential ring, the circumferential ring defining the cavity.
11. The semiconductor device assembly of claim 1 , wherein the conductive spacer includes a copper spacer and the cavity is mechanically stamped in a surface of the copper spacer.
12. The semiconductor device assembly of claim 1 , wherein the conductive spacer includes:
a copper spacer portion; and
a cavity portion disposed on the copper spacer portion.
13. The semiconductor device assembly of claim 12 , wherein the cavity portion includes at least one of a solder paste or a stamped solder preform.
14. The semiconductor device assembly of claim 1 , wherein:
the cavity is defined in a surface of the conductive spacer; and
the first surface of the semiconductor die is noncoplanar with the surface of the conductive spacer.
15. The semiconductor device assembly of claim 1 , wherein:
the cavity is defined in a surface of the conductive spacer; and
the first surface of the semiconductor die is coplanar with the surface of the conductive spacer.
16. A semiconductor device assembly comprising:
a semiconductor die;
a conductive spacer having a cavity defined in a first surface of the conductive spacer, the semiconductor die being electrically and thermally coupled with the conductive spacer, the semiconductor die being at least partially embedded in the cavity;
a first direct bonded metal (DBM) substrate, the first DBM substrate being electrically coupled with a surface of the semiconductor die;
a second DBM substrate coupled with a second surface of the conductive spacer, the second surface of the conductive spacer being opposite the first surface of the conductive spacer;
a low-modulus encapsulation material, the low-modulus encapsulation material being disposed between the conductive spacer and the first DBM substrate, and disposed between the surface of the semiconductor die and the first DBM substrate; and
a molding compound, the molding compound encapsulating the semiconductor die, the conductive spacer, the low-modulus encapsulation material, the first DBM substrate, and the second DBM substrate.
17. The semiconductor device assembly of claim 16 , wherein the low-modulus encapsulation material is a silicone-based gel material.
18. The semiconductor device assembly of claim 17 , wherein the semiconductor die is thermally and electrically coupled with the conductive spacer by a fluxless solder material disposed in the cavity.
19. A semiconductor device assembly comprising:
a first semiconductor die;
a second semiconductor die;
a first conductive spacer having a cavity defined in a first surface of the first conductive spacer, the first semiconductor die being electrically and thermally coupled with the first conductive spacer, the first semiconductor die being at least partially embedded in the cavity of the first conductive spacer;
a second conductive spacer having a cavity defined in a first surface of the second conductive spacer, the second semiconductor die being electrically and thermally coupled with the second conductive spacer, the second semiconductor die being at least partially embedded in the cavity of the second conductive spacer;
a first direct bonded metal (DBM) substrate, the first DBM substrate being electrically coupled with a surface of the first semiconductor die and electrically coupled with a surface of the second semiconductor die; and
a second DBM substrate electrically and thermally coupled with:
a second surface of the first conductive spacer, the second surface of the first conductive spacer being opposite the first surface of the first conductive spacer; and
a second surface of the second conductive spacer, the second surface of the second conductive spacer being opposite the first surface of the second conductive spacer.
20. The semiconductor device assembly of claim 19 , further comprising a low-modulus encapsulation material, the low-modulus encapsulation material being:
disposed between the first conductive spacer and the first DBM substrate;
disposed between the surface of the first semiconductor die and the first DBM substrate;
disposed between the second conductive spacer and the first DBM substrate; and
disposed between the surface of the second semiconductor die and the first DBM substrate.
21. The semiconductor device assembly of claim 20 , further comprising a molding compound, the molding compound encapsulating the first semiconductor die, the second semiconductor die, the first conductive spacer, the second conductive spacer, the low-modulus encapsulation material, the first DBM substrate, and the second DBM substrate,
a surface of the first DBM substrate being exposed through the molding compound, and
a surface of the second DBM substrate being exposed through the molding compound.