Tape heating methods
View Patent ↗Implementations of a method of increasing the adhesion of a tape. Implementations may include: mounting a tape to a frame, mounting a substrate to the tape, heating the tape after mounting the substrate at one or more temperatures for a predetermined period of time, and increasing an adhesion of the tape to the substrate through heating the tape.
1. A method of increasing an adhesion of a dicing tape, the method comprising:
mounting the dicing tape to a frame;
adhering a substrate directly to the dicing tape through mounting the substrate to the dicing tape after the dicing tape is mounted to the frame;
heating the dicing tape after mounting the substrate at one or more temperatures for a predetermined period of time to increase an adhesion of the dicing tape to the substrate through the heating of the dicing tape; and
removing one or more portions of the substrate through releasing the dicing tape from the one or more portions;
wherein the one or more temperatures is one of a temperature ramp up, a temperature ramp down, or any combination thereof during the predetermined period of time.
2. The method of claim 1 , further comprising at least partially singulating the substrate on the dicing tape after mounting and flipping the at least partially singulated substrate onto a second tape before heating the dicing tape.
3. The method of claim 1 , wherein the one or more temperatures is a single temperature during the predetermined period of time.
4. The method of claim 1 , wherein heating the dicing tape further comprises heating using a heating chuck.
5. The method of claim 1 , wherein heating the dicing tape further comprises heating using two or more heating chucks.
6. The method of claim 1 , wherein the one or more temperatures are less than 100 C.
7. A method of increasing an adhesion of a dicing tape, the method comprising:
adhering a semiconductor substrate directly to dicing tape through mounting the semiconductor substrate to the dicing tape after mounting the dicing tape to a frame;
heating the dicing tape after mounting the semiconductor substrate at one or more temperatures less than 100 C for a predetermined period of time to increase an adhesion of the dicing tape to the semiconductor substrate through the heating of the dicing tape; and
removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
8. The method of claim 7 , further comprising at least partially singulating the substrate on the dicing tape after mounting and flipping the at least partially singulated substrate onto a second tape before heating the dicing tape.
9. The method of claim 7 , wherein the one or more temperatures is one of a temperature ramp up, a temperature ramp down, or any combination thereof during the predetermined period of time.
10. The method of claim 7 , wherein the one or more temperatures is a single temperature during the predetermined period of time.
11. The method of claim 7 , wherein heating the dicing tape further comprises heating using a heating chuck.
12. The method of claim 7 , wherein heating the dicing tape further comprises heating using two or more heating chucks.
13. A method of preventing die loss from a dicing tape, the method comprising:
adhering a semiconductor substrate directly to a dicing tape through mounting the semiconductor substrate to the dicing tape;
heating the dicing tape after mounting the semiconductor substrate at one or more temperatures for a predetermined period of time to increase an adhesion of the plurality of die to the dicing tape through the heating of the dicing tape;
at least partially singulating a plurality of die from the semiconductor substrate before heating the dicing tape;
preventing die from prematurely decoupling from the dicing tape during subsequent processing operations through the increasing adhesion of the plurality of die to the dicing tape; and
removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
14. The method of claim 13 , wherein the one or more temperatures is a single temperature during the predetermined period of time.
15. The method of claim 13 , further comprising flipping the at least partially singulated substrate onto a second tape before heating the dicing tape.
16. The method of claim 13 , wherein the one or more temperatures is one of a temperature ramp up, a temperature ramp down, or any combination thereof during the predetermined period of time.
17. The method of claim 13 , wherein heating the dicing tape further comprises heating using a heating chuck.
18. The method of claim 13 , wherein heating the dicing tape further comprises heating using two or more heating chucks.
19. The method of claim 13 , wherein the one or more temperatures are less than 100 C.