Patent Assignment
Reel/Frame 046519/0907
Assignment of Assignor's Interest
Recorded: 2018-07-31
Pages: 5
Assignors
WAN, ALBERT
Executed: 2018-07-02
SHIH, CHAO-WEN
Executed: 2018-07-02
PU, HAN-PING
Executed: 2018-07-10
PAN, HSIN-YU
Executed: 2018-07-12
HSU, SEN-KUEI
Executed: 2018-07-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU,, 30078, TAIWAN
Covered Property
(1)
Packaging of Semiconductor Device with Antenna and Heat Spreader
Patent:
10,490,479 →
Application:
16/016,656 →