Patent Assignment
Reel/Frame 046524/0620
Assignment of Assignor's Interest
Recorded: 2018-08-01
Pages: 4
Assignors
LIU, CHUNG-SHI
Executed: 2018-06-21
LEE, CHIEN-HSUN
Executed: 2018-06-21
WU, JIUN YI
Executed: 2018-06-21
HOU, HAO-CHENG
Executed: 2018-06-21
LIN, HUNG-JEN
Executed: 2018-06-21
CHENG, JUNG WEI
Executed: 2018-06-21
WANG, TSUNG-DING
Executed: 2018-06-21
LIANG, YU-MIN
Executed: 2018-06-21
CHOU, LI-WEI
Executed: 2018-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Redistribution Structures in Semiconductor Packages and Methods of Forming Same