Patent Assignment
Reel/Frame 046525/0974
Assignment of Assignor's Interest
Recorded: 2018-08-01
Pages: 4
Assignor
KIM, KIL-SOO
Executed: 2018-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Processor Chip and Memory Chip