Patent Assignment
Reel/Frame 046536/0970
Assignment of Assignor's Interest
Recorded: 2018-08-02
Pages: 3
Assignors
HUANG, SHIH-WEN
Executed: 2018-06-26
LIN, CHIA-HUI
Executed: 2018-07-05
CHANG, JAMING
Executed: 2018-07-03
CHEN, JEI MING
Executed: 2018-07-03
CHENG, KAI HUNG
Executed: 2018-07-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Fin Cutting Process and Structures Formed Thereby