IP Library › Assignment 046538/0007
Patent Assignment
Reel/Frame 046538/0007

Assignment of Assignor's Interest

Recorded: 2018-07-11 Pages: 5
Assignors
BANG, WON BAE
Executed: 2016-04-19
KIM, BYONG JIN
Executed: 2016-05-09
KIM, GI JEONG
Executed: 2016-05-10
KWON, JAE DOO
Executed: 2016-06-02
JEON, HYUNG IL
Executed: 2016-05-09
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package Having Routable Encapsulated Conductive Substrate and Method
Application: 16/032,295 →
Publication: US 2018/0323129
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.
Reel/Frame 052496/0182 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →