Patent Assignment
Reel/Frame 046557/0984
Assignment of Assignor's Interest
Recorded: 2018-08-06
Pages: 4
Assignee
NOVATEK MICROELECTRONICS CORP.
2F, NO. 13, INNOVATION ROAD I, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Chip on Film Package and Heat-Dissipation Structure for a Chip Package