Patent Assignment
Reel/Frame 046559/0316
Assignment of Assignor's Interest
Recorded: 2018-08-06
Pages: 9
Assignors
HO, CHENG-YING
Executed: 2016-06-29
WANG, CHING-CHUN
Executed: 2018-06-29
YAUNG, DUN-NIAN
Executed: 2016-07-13
HUNG, FENG-CHI
Executed: 2016-06-29
LU, YAN-CHIH
Executed: 2016-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Metal Block and Bond Pad Structure