Patent Assignment
Reel/Frame 046560/0261
Assignment of Assignor's Interest
Recorded: 2018-08-06
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-07-09
YEH, SUNG-FENG
Executed: 2018-07-06
CHEN, MING-FA
Executed: 2018-07-06
CHEN, HSIEN-WEI
Executed: 2018-07-09
LIU, HUI-WEN
Executed: 2018-07-06
YUAN, CHING-PIN
Executed: 2018-07-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device Package Having Testing Pads On a Topmost Die