Patent Assignment
Reel/Frame 046587/0222
Assignment of Assignor's Interest
Recorded: 2018-08-08
Pages: 4
Assignors
HUANG, SHIH-WEN
Executed: 2018-06-26
KO, CHUNG-TING
Executed: 2018-07-03
KE, HONG-HSIEN
Executed: 2018-06-26
LIN, CHIA-HUI
Executed: 2018-07-05
HUANG, TAI-CHUN
Executed: 2018-06-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Barrier Layer and Method for Forming the Same