Patent Assignment
Reel/Frame 046618/0092
Assignment of Assignor's Interest
Recorded: 2018-08-10
Pages: 2
Assignors
SUEN, SHICH-CHANG
Executed: 2018-07-10
CHEN, LIANG-GUANG
Executed: 2018-07-10
CHEN, KEI-WEI
Executed: 2018-07-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chemical Mechanical Polishing Apparatus and Method