Patent Assignment
Reel/Frame 046631/0107
Assignment of Assignor's Interest
Recorded: 2018-08-13
Pages: 7
Assignors
LEE, DONG WON
Executed: 2018-06-05
PARK, SUNG HO
Executed: 2018-06-05
LEE, MIN KYU
Executed: 2018-06-15
Assignee
LG INNOTEK CO., LTD.
98, HUAM-RO JUNG-GU, SEOUL, 04637, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Device Package Having a Black Epoxy Molding Compound (Emc) Body and Lighting Apparatus Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.