Patent Assignment
Reel/Frame 046640/0907
Assignment of Assignor's Interest
Recorded: 2018-08-21
Pages: 3
Assignor
VADHAVKAR, SAMEER S.
Executed: 2011-08-26
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Solid-State Radiation Transducer Devices Having Flip-Chip Mounted Solid-State Radiation Transducers and Associated Systems and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →