Patent Assignment
Reel/Frame 046641/0073
Assignment of Assignor's Interest
Recorded: 2018-08-21
Pages: 9
Assignor
SUNEDISON SEMICONDUCTOR LIMITED
Executed: 2018-06-06
Assignee
GLOBALWAFERS CO., LTD.
NO. 8 INDUSTRIAL EAST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Property
(1)
Method of Manufacturing High Resistivity Soi Wafers with Charge Trapping Layers Based on Terminated Si Deposition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.