Patent Assignment
Reel/Frame 046650/0721
Assignment of Assignor's Interest
Recorded: 2018-08-21
Pages: 2
Assignor
WU, TUNG-JIUN
Executed: 2018-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD, 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof