Patent Assignment
Reel/Frame 046656/0821
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 3
Assignee
LUMENS CO., LTD.
12 WONGOMAE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17086, KOREA, REPUBLIC OF
Covered Property
(1)
Led Chip with Improved Bonding Strength and Led Module Using the Led Chip