Patent Assignment
Reel/Frame 046658/0254
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same