Patent Assignment
Reel/Frame 046659/0555
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 7
Assignors
CHUNG, SANG-GYO
Executed: 2018-05-30
KANG, YUN-SEUNG
Executed: 2018-05-30
LEE, SOUNG-HEE
Executed: 2018-05-30
LEE, JI-SEUNG
Executed: 2018-05-30
LEE, HYUN-CHUL
Executed: 2018-05-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Integrated Circuit Devices