Patent Assignment
Reel/Frame 046661/0713
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 11
Assignors
CHEN, HSIA-WEI
Executed: 2017-03-13
CHANG, CHIH-YANG
Executed: 2017-03-13
YANG, CHIN-CHIEH
Executed: 2017-03-13
YANG, JEN-SHENG
Executed: 2017-03-13
TU, KUO-CHI
Executed: 2017-03-13
CHU, WEN-TING
Executed: 2017-03-13
LIAO, YU-WEN
Executed: 2017-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Landing Method for Rram Technology