Patent Assignment
Reel/Frame 046668/0182
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 5
Assignors
WANG, SHENG-MING
Executed: 2018-08-17
CHEN, TIEN-SZU
Executed: 2018-08-17
SHEN, WEN-CHIH
Executed: 2018-08-17
LEE, HSING-WEN
Executed: 2018-08-17
FENG, HSIANG-MING
Executed: 2018-08-16
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same