Patent Assignment
Reel/Frame 046676/0806
Assignment of Assignor's Interest
Recorded: 2018-08-23
Pages: 2
Assignor
YU, DAQUAN
Executed: 2018-07-30
Assignee
HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
112 LONGTENG ROAD, ECONOMIC AND TECHNICAL DEVELOPMENT ZONE, KUNSHAN, JIANGSU, 215300, CHINA
Covered Property
(1)
Embedded Silicon Substrate Fan-Out Type 3D Packaging Structure