Patent Assignment
Reel/Frame 046690/0762
Assignment of Assignor's Interest
Recorded: 2018-08-02
Pages: 4
Assignors
CHUNG, JAE HO
Executed: 2018-07-30
NOH, SOO HO
Executed: 2018-07-30
PARK, JIN SEOK
Executed: 2018-07-30
JANG, SE YOUNG
Executed: 2018-07-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Cooling Structure