Electronic device including cooling structure
An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
1. An electronic device comprising:
a housing;
a printed circuit board located inside the housing;
an electrical element mounted on the printed circuit board; and
a shield can configured to cover the electrical element,
wherein a recess area is formed on at least a portion of the shield can and a metal structure is mounted in the recess area to cool heat generated by the electrical element,
wherein the metal structure contains fluid or a phase change material for cooling the heat generated by the electrical element, and
wherein the metal structure is disposed on an upper surface of the electrical element.
2. The electronic device of claim 1 , wherein a thermal conductivity of a material of the metal structure is greater than a thermal conductivity of a material of the shield can.
3. The electronic device of claim 1 , wherein the metal structure comprises a tube or a chamber.
4. The electronic device of claim 1 , wherein the shield can includes a metal plate disposed between the electrical element and the recess area, and
wherein the metal plate has a larger area than a surface thereof which is in contact with the electrical element.
5. The electronic device of claim 4 , wherein a thermal conductivity of a material of the metal plate is greater than a thermal conductivity of a material of the shield can.
6. The electronic device of claim 4 , wherein the metal plate comprises an alloy including a material comprising the metal structure.
7. The electronic device of claim 4 , wherein the metal plate is directly attached to the metal structure.
8. The electronic device of claim 4 , wherein the metal plate has a smaller thickness than the shield can.
9. The electronic device of claim 4 , wherein the metal plate comprises a plurality of stacked plates, and
wherein the plurality of stacked plates includes a first plate disposed between the metal structure and the electrical element and a second plate disposed to surround the first plate and connected to the shield can.
10. The electronic device of claim 1 , further comprising a cover heat sheet attached to at least a portion of the housing adjacent to the shield can.
11. The electronic device of claim 1 , further comprising:
at least one support disposed between the housing and the shield can, wherein the support is configured to provide an air layer between the housing and the shield can.
12. The electronic device of claim 1 , wherein the recess area comprises one of a hole passing through the shield can or a groove formed in a direction toward the electrical element.
13. The electronic device of claim 1 , wherein the recess area corresponds to a thinned area of a first surface of the shield can.
14. The electronic device of claim 1 , wherein a plurality of electrical elements mounted on the printed circuit board are included in the shield can,
wherein a first portion of the metal structure is disposed adjacent to a first element of the plurality of electrical elements, and
wherein a second portion of the metal structure is disposed adjacent to a second element of the plurality of electrical elements.