Patent Assignment
Reel/Frame 046708/0010
Assignment of Assignor's Interest
Recorded: 2018-08-27
Pages: 4
Assignors
KHADERBAD, MRUNAL A
Executed: 2018-08-20
OKUNO, YASUTOSHI
Executed: 2018-08-07
WANG, SUNG-LI
Executed: 2018-08-07
TSAI, PANG-YEN
Executed: 2018-08-07
LEE, SHEN-NAN
Executed: 2018-08-07
TSAI, TENG-CHUN
Executed: 2018-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Contact Plugs for Semiconductor Device