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Patent Assignment
Reel/Frame 046710/0908

Assignment of Assignor's Interest

Recorded: 2018-08-27 Pages: 5
Assignors
MORRIS, THOMAS SCOTT
Executed: 2015-05-22
MEEDER, MICHAEL
Executed: 2015-05-22
Assignee
QORVO US, INC.
7628 THORNDIKE ROAD, GREENSBORO, NORTH CAROLINA, 27409
Covered Property (1)
Using an Interconnect Bump to Traverse Through a Passivation Layer of a Semiconductor Die
Application: 16/113,243 →
Publication: US 2018/0366431