Patent Assignment
Reel/Frame 046711/0093
Assignment of Assignor's Interest
Recorded: 2018-08-01
Pages: 2
Assignors
KUO, HUNG-JUI
Executed: 2018-07-23
HSIEH, YUN CHEN
Executed: 2018-07-23
TSAI, HUI-JUNG
Executed: 2018-07-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method
Patent:
10,515,848 →
Application:
16/052,334 →