Patent Assignment
Reel/Frame 046733/0442
Assignment of Assignor's Interest
Recorded: 2018-08-07
Pages: 10
Assignors
CAO, BINBIN
Executed: 2018-06-09
QIAN, HAIJIAO
Executed: 2018-06-09
YANG, CHENGSHAO
Executed: 2018-06-09
HUANG, YINHU
Executed: 2018-06-09
Assignees
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
XINZHAN INDUSTRIAL PARK, ANHUI, HEFEI, 230012, CHINA
Covered Property
(1)
Manufacturing Method of Array Substrate Using Dry Etching Processing and Wet Etching Processing, Array Substrate and Display Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.