Patent Assignment
Reel/Frame 046765/0905
Assignment of Assignor's Interest
Recorded: 2018-08-31
Pages: 8
Assignors
CHEN, JHIH-BIN
Executed: 2018-08-14
TSAI, CHIA-SHIUNG
Executed: 2018-08-15
LIU, MING CHYI
Executed: 2018-08-14
CHEN, EUGENE
Executed: 2018-08-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structures for Bonding a Group Iii-V Device to a Substrate by Stacked Conductive Bumps