IP Library Assignment 046767/0370
Patent Assignment
Reel/Frame 046767/0370

Assignment of Assignor's Interest

Recorded: 2018-08-31 Pages: 4
Assignor
DEFOND COMPONENTS LIMITED
Executed: 2018-07-28
Assignees
DEFOND COMPONENTS LIMITED
5/F, CHAI WAN INDUSTRIAL CENTRE, 20 LEE CHUNG STREET, CHAI WAN, HONG KONG
DEFOND ELECTECH CO., LTD.
HONGMEI SECOND INDUSTRIAL AREA, HONGMEI TOWN, DONGGUAN, GUANGDONG, 523160, CHINA
Covered Property (1)
Transducer Device
Application: 16/105,648 →
Publication: US 2019/0086945
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 31, 2018
From: NIEH, CHENG CHEN; KO, HOI HIM
To: DEFOND COMPONENTS LIMITED
Reel/Frame 046767/0225 →
Assignment of Assignor's Interest Sep 7, 2020
From: NIEH, CHENG CHEN; KO, HOI HIM
To: DEFOND ELECTRICAL INDUSTRIES LIMITED
Reel/Frame 053703/0005 →
Assignment of Assignor's Interest Sep 7, 2020
From: DEFOND ELECTRICAL INDUSTRIES LIMITED
To: DEFOND COMPONENTS LIMITED; DONGGUAN CHEN DA APPLIANCE CO. LTD.
Reel/Frame 053703/0038 →
Change of Name Sep 7, 2020
From: DONGGUAN CHEN DA APPLIANCE CO., LTD.
To: DEFOND ELECTECH CO., LTD.
Reel/Frame 053717/0429 →