Patent Assignment
Reel/Frame 046773/0915
Assignment of Assignor's Interest
Recorded: 2018-08-14
Pages: 4
Assignors
WU, JUNG-TANG
Executed: 2018-07-24
TUNG, SZU-PING
Executed: 2018-07-24
WU, SZU-HUA
Executed: 2018-07-24
PAN, SHING-CHYANG
Executed: 2018-07-24
WU, MENG-YU
Executed: 2018-07-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Via Structure, Mram Device Using the via Structure and Method for Fabricating the Mram Device