Patent Assignment
Reel/Frame 046777/0934
Assignment of Assignor's Interest
Recorded: 2018-09-04
Pages: 2
Assignors
CHEN, JIE
Executed: 2018-08-23
CHEN, HSIEN-WEI
Executed: 2018-08-23
CHEN, MING-FA
Executed: 2018-08-23
YU, CHEN-HUA
Executed: 2018-08-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Buffer Design for Package Integration