Patent Assignment
Reel/Frame 046782/0766
Assignment of Assignor's Interest
Recorded: 2018-09-04
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-08-06
SU, AN-JHIH
Executed: 2018-08-08
WU, CHI-HSI
Executed: 2018-08-06
CHIOU, WEN-CHIH
Executed: 2018-08-06
WU, TSANG-JIUH
Executed: 2018-08-07
YEH, DER-CHYANG
Executed: 2018-08-07
YEH, MING SHIH
Executed: 2018-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via for Semiconductor Device Connection and Methods of Forming the Same