Patent Assignment
Reel/Frame 046789/0547
Assignment of Assignor's Interest
Recorded: 2018-09-05
Pages: 4
Assignee
SHIN-ETSU POLYMER CO., LTD.
9, KANDASUDA-CHO 1-CHOME, CHIYODA-KU, TOKYO, 101-0041, JAPAN
Covered Property
(1)
Adhesive Substrate and Method for Separating an Object from an Adhesive Substrate