Adhesive substrate and method for separating an object from an adhesive substrate
An adhesive substrate is disclosed, which includes a base substrate and a heat-resistant elastomer layer formed on the base substrate, wherein the base substrate is flexible and has a thickness of 0.2 mm or more and 2 mm or less, wherein the adhesive substrate is used as part of a method for physically separating an object that has been held immovable in such a manner that the object has been adhered to by the heat-resistant elastomer layer and the object is anchored from the upper side, and wherein by starting to physically separate the end portion of the adhesive substrate downward the object is able to be separated.
1. A method for physically separating an object from an adhesive substrate, wherein the object is attached to a heat-resistant elastomer layer of the adhesive substrate, comprising the steps of:
1) anchoring an upper side of the object by attaching a fixing means; and
2) applying a downward force to a base substrate of the adhesive substrate, thereby causing the heat-resistant elastomer layer to bend, resulting in separation,
wherein the adhesive substrate is repeatedly used, and
the adhesive substrate returns to its original state after the object is separated from the adhesive substrate.
2. The method of claim 1 , wherein the downward force is applied by a cable attached to the base substrate.
3. The method of claim 1 , wherein the downward force is applied to a holding plate situated on the surface of the heat-resistant elastomer layer in an area where the object and the adhesive substrate do not overlap.
4. The method of claim 1 , wherein the adhesive substrate comprises:
the base substrate, wherein the base substrate is flexible; and
the heat-resistant elastomer layer on the base substrate.
5. The method of claim 4 , wherein a Young's modulus of the base substrate is 2 GPa or more and 300 GPa or less.