Patent Assignment
Reel/Frame 046799/0335
Assignment of Assignor's Interest
Recorded: 2018-08-14
Pages: 3
Assignors
CHEN, CHIH-LIN
Executed: 2018-06-19
LIU, CHIN-CHOU
Executed: 2018-07-03
CHANG, FONG-YUAN
Executed: 2018-06-19
LEE, HUI-YU
Executed: 2018-06-19
HUANG, PO-HSIANG
Executed: 2018-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
A Second Semiconductor Wafer Attached to a First Semiconductor Wafer with a Through Hole Connected to an Inductor