Patent Assignment
Reel/Frame 046810/0867
Assignment of Assignor's Interest
Recorded: 2018-09-07
Pages: 4
Assignors
LEE, LI-GUO
Executed: 2014-02-07
LIU, YUNG-SHENG
Executed: 2014-02-07
LIU, YI-CHEN
Executed: 2014-02-07
LAI, YI-JEN
Executed: 2014-02-07
CHEN, CHUN-JEN
Executed: 2014-02-13
CHENG, HSI-KUEI
Executed: 2014-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Bump Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.