Patent Assignment
Reel/Frame 046812/0423
Assignment of Assignor's Interest
Recorded: 2018-09-07
Pages: 5
Assignor
NANBA, HIROMITSU
Executed: 2018-08-20
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, and Storage Medium