IP Library › Assignment 046831/0534
Patent Assignment
Reel/Frame 046831/0534

Assignment of Assignor's Interest

Recorded: 2018-08-14 Pages: 3
Assignor
SREENIVASAN, KODURI
Executed: 2018-08-04
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, M/S 3999, DALLAS, TEXAS, 75243
Covered Property (1)
Shaped Interconnect Bumps in Semiconductor Devices
Application: 16/103,839 →
Publication: US 2019/0109110
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Namoe of Assignor Previously Recorded at Reel: 046831 Frame: 0534. Assignor(S) Hereby Confirms the Assignment. Sep 18, 2018
From: KODURI, SREENIVASAN K.
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 047569/0196 →