Assignment of Assignor's Interest

Recorded: 2018-09-11 Pages: 3

Assignors

SHEN, DONGNA

Executed: 2018-07-19

YANG, YI

Executed: 2018-07-19

WANG, YU-JEN

Executed: 2018-07-19

Assignee

HEADWAY TECHNOLOGIES, INC.

678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035

Covered Property (1)

A Method of Etching a Mtj Stack of Layers Utilizing Reactive-Ion-Etch (Rie) or Ion Beam Etch (Ibe) Process

Application: 16/056,770 →

Publication: US 2020/0052196

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.