Patent Assignment
Reel/Frame 046846/0397
Assignment of Assignor's Interest
Recorded: 2018-09-12
Pages: 5
Assignors
LEE, IN-HAK
Executed: 2018-08-04
BAECK, SANG-YEOP
Executed: 2018-08-04
CHOI, JAE-SEUNG
Executed: 2018-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Device System-on-Chip Including the Same and Method of Operating the Same