Patent Assignment
Reel/Frame 046849/0629
Assignment of Assignor's Interest
Recorded: 2018-09-12
Pages: 5
Assignors
LEE, HAEJIN
Executed: 2018-08-03
KOO, KYUNGHA
Executed: 2018-08-03
JUNG, CHUNGHYO
Executed: 2018-08-03
JANG, SE-YOUNG
Executed: 2018-08-03
BANG, JUNGJE
Executed: 2018-08-03
YE, JAEHEUNG
Executed: 2018-08-03
CHO, CHI-HYUN
Executed: 2018-08-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Having Heat Collection/Diffusion Structure