Patent Assignment
Reel/Frame 046851/0259
Assignment of Assignor's Interest
Recorded: 2018-09-12
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Layer Structure Having a Dense Middle Layer
Patent:
10,510,586 →
Application:
16/124,324 →