Patent Assignment
Reel/Frame 046873/0434
Assignment of Assignor's Interest
Recorded: 2018-09-14
Pages: 5
Assignors
LIN, SHIH-TING
Executed: 2018-06-05
KAO, CHIN-FU
Executed: 2018-06-05
LIN, JING-CHENG
Executed: 2018-08-31
CHENG, LI-HUI
Executed: 2018-06-05
LU, SZU-WEI
Executed: 2018-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package-On-Package Structure and Manufacturing Method Thereof
Patent:
10,438,934 →
Application:
15/979,494 →