Patent Assignment
Reel/Frame 046887/0197
Assignment of Assignor's Interest
Recorded: 2018-09-17
Pages: 4
Assignors
LI, PENG
Executed: 2018-06-26
ARGUEDAS, SERGIO ANTONIO CHAN
Executed: 2018-06-26
LIU, YONGMEI
Executed: 2018-06-26
GOYAL, DEEPAK
Executed: 2018-06-26
HACKENBERG, KEN
Executed: 2018-06-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Assemblies Including a Thermal Interface Material
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.