Microelectronic assemblies including a thermal interface material
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.
1. A microelectronic assembly, comprising:
a package substrate having a first surface and an opposing second surface;
a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate;
a cooling apparatus thermally coupled to the second surface of the die; and
a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM is a ternary indium alloy that includes indium, titanium, and copper or aluminum, and wherein the ternary indium alloy further includes copper or aluminum having a weight percent of 30 or less.
2. The microelectronic assembly of claim 1 , wherein the ternary indium alloy includes aluminum having a weight percent of 30 or less.
3. The microelectronic assembly of claim 1 , wherein the ternary indium alloy includes copper having a weight percent of 3 or less.
4. The microelectronic assembly of claim 1 , wherein the ternary indium alloy includes aluminum having a weight percent of 3 or less.
5. The microelectronic assembly of claim 1 , further comprising:
a circuit board, wherein a surface of the circuit board is coupled to the first surface of the package substrate.
6. The microelectronic assembly of claim 5 , wherein the circuit board is coupled to the package substrate by ball grid array interconnects.
7. The microelectronic assembly of claim 1 , wherein the cooling apparatus includes a heat sink, a heat spreader, an integrated heat spreader, or a cooling plate.
8. A microelectronic assembly, comprising:
a package substrate having a first surface and an opposing second surface;
a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate;
a cooling apparatus thermally coupled to the second surface of the die; and
a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, the TIM having a liquidus temperature between 245 degrees Celsius and 800 degrees Celsius, and wherein the TIM is a ternary indium alloy that includes indium, titanium, and copper or aluminum, and wherein the ternary indium alloy includes copper or aluminum having a weight percent of 30 or less.
9. The microelectronic assembly of claim 8 , wherein the ternary indium alloy includes copper having a weight percent of 30 or less.
10. The microelectronic assembly of claim 8 , wherein the ternary indium alloy includes copper having a weight percent of 3 or less.
11. The microelectronic assembly of claim 8 , wherein the ternary indium alloy includes aluminum having a weight percent of 3 or less.
12. The microelectronic assembly of claim 8 , wherein the TIM has a thickness between 25 microns and 500 microns.
13. A thermal interface material for bonding components of electronic components, the thermal interface material comprising:
a ternary indium alloy having a liquidus temperature between 245 degrees Celsius and 800 degrees Celsius, wherein the ternary indium alloy includes indium, titanium, and copper or aluminum, and wherein the ternary indium alloy includes copper or aluminum having a weight percent of 30 or less.