Patent Assignment
Reel/Frame 046888/0158
Assignment of Assignor's Interest
Recorded: 2018-09-17
Pages: 2
Assignor
MASUDA, YOSHIAKI
Executed: 2018-08-28
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 1080075, JAPAN
Covered Property
(1)
Chip Size Package, Method of Manufacturing the Same, Electronic Device, and Endoscope